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- Titre : Dry-Film-Solution-for-TSV.pdf
- Submitted by : Anonymous
- Description : System for TSV Via Formation/Protection/Plating Colin Tsai DuPont APL ATG Specialist March 19, 2008. 03/24/08 2 Content
Transcription
Unique Dry Film Photoresist
System for TSV Via
Formation/Protection/Plating
March 19, 2008
Colin Tsai
DuPont APL ATG Specialist
2
Content
3D-TSV/TSV Process Overview
Advantages of using dry film photoresist
Dry film photoresist for 3D-TSV Process
Summary
03/24/08
Our Mission
3
To enhance customers’ competitiveness and
profitability by offering
Application knowledge
Materials
Integrated Process Technology
03/24/08
DuPont Lithography Material Features
DuPont Lithography Material Features
4
High Aspect Ratio Imaging
• Thick polymer films (50-120um) for thick
plating and stencil applications
• Strong heat resistance
• Clean removal
Fine Feature Imaging
• Thin polymer films (10-30um) for
high definition plating and etching
applications
High Definition Permanent Dielectrics
• Polymer films for permanent structuring and
dielectric applications
03/24/08
5
Content
3D-TSV/TSV Process Overview
Advantages of using dry film photoresist
Dry film photoresist for 3D-TSV Process
Summary
03/24/08
3D-TSV/TSV Process Overview
6
03/24/08
7
Content
3D-TSV/TSV Process Overview
Advantages of using dry film photoresist
Dry film photoresist for 3D-TSV Process
Summary
03/24/08
Dry Film process
8
Wafer
03/24/08