HDC2080 Low-Power Humidity and Temperature Digital Sensor
HDC2080
SNAS678C – MAY 2018 – REVISED JULY 2021
1 Features
3 Description
• Relative humidity range: 0% to 100%
• Humidity accuracy: ±2% (typical), ±3% (maximum)
• Temperature accuracy: ±0.2°C (typical), ±0.4°C
• Sleep mode current: 50 nA (typical), 100 nA
(maximum)
(maximum )
• Average supply current (1 measurement/second)
– 300 nA: RH% only (11 bit)
– 550 nA: RH% (11 bit) + temperature (11 bit)
• Temperature range:
– Operating: –40°C to 85°C
– Functional: –40°C to 125°C
• Supply voltage range: 1.62 V to 3.6 V
• Available auto measurement mode
•
I2C interface compatibility
2 Applications
• Smart thermostats
• Smart home assistants
• Washer/dryers
• HVAC systems
Inkjet printers
•
Typical Application
is an
integrated humidity
The HDC2080 device
and temperature sensor that provides high accuracy
measurements with very low power consumption in
a small DFN package. The capacitive-based sensor
includes new integrated digital features and a heating
element to dissipate condensation and moisture.
The HDC2080 digital features include programmable
interrupt thresholds to provide alerts and system
to
wake-ups without
be continuously monitoring the system. Combined
with programmable sampling intervals, a low power
consumption, and a support for a 1.8-V supply
for battery-
voltage,
operated systems.
requiring a microcontroller
the HDC2080
is designed
for a wide
The HDC2080 provides high accuracy measurement
capability
range of environmental
monitoring and Internet of Things (IoT) applications
such as smart
thermostats and smart home
assistants. For designs where printed-circuit board
(PCB) area is critical, a smaller CSP package option
is available thru the HDC2010 with complete software
compatibility with the HDC2080.
For applications with strict power-budget restrictions,
Auto Measurement Mode enables the HDC2080
to automatically initiate temperature and humidity
measurements. This feature allows users to configure
a microcontroller into deep sleep mode because
the HDC2080 is no longer dependent upon the
microcontroller to initiate a measurement.
PART NUMBER
BODY SIZE (NOM)
Device Information(1)
PACKAGE
HDC2080
WSON (6)
3.00 mm × 3.00 mm
(1)
For all available packages, see the orderable addendum at
the end of the data sheet.
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
RH Accuracy (TA = 30°C)
RHSensorTemperatureSensorRegisters+LogicCalibrationI2CADCADCSCLSDADRDY/INTADDRHDC2080VDDMCUVDDGPIOI2CMasterGNDGND1.80VRH (%RH)Accuracy (r%RH)0102030405060708090100012345678910Typical HDC2080
SNAS678C – MAY 2018 – REVISED JULY 2021
www.ti.com
Table of Contents
1 Features………………………………………………………………….1
2 Applications…………………………………………………………… 1
3 Description……………………………………………………………..1
4 Revision History…………………………………………………….. 2
5 Description (continued)………………………………………….. 4
6 Pin Configuration and Functions……………………………..4
7 Specifications………………………………………………………… 5
7.1 Absolute Maximum Ratings ………………………………… 5
7.2 ESD Ratings …………………………………………………….. 5
7.3 Recommended Operating Conditions ……………………5
7.4 Thermal Information ……………………………………………5
7.5 Electrical Characteristics ……………………………………..6
7.6 Switching Characteristics …………………………………….7
7.7 Timing Diagram…………………………………………………..7
7.8 Typical Characteristics………………………………………… 8
8 Detailed Description………………………………………………..9
8.1 Overview…………………………………………………………… 9
8.2 Functional Block Diagram……………………………………. 9
8.3 Feature Description……………………………………………..9
8.4 Device Functional Modes……………………………………16
8.5 Programming…………………………………………………… 16
8.6 Register Maps…………………………………………………..17
9 Application and Implementation …………………………… 30
9.1 Application Information……………………………………… 30
9.2 Typical Application……………………………………………. 30
10 Power Supply Recommendations…………………………32
11 Layout………………………………………………………………… 32
11.1 Layout Guidelines…………………………………………… 32
11.2 Layout Example……………………………………………… 34
12 Device and Documentation Support……………………..35
12.1 Documentation Support…………………………………… 35
12.2 Receiving Notification of Documentation Updates..35
12.3 Support Resources…………………………………………. 35
12.4 Trademarks……………………………………………………. 35
12.5 Electrostatic Discharge Caution…………………………35
12.6 Glossary…………………………………………………………35
13 Mechanical, Packaging, and Orderable
Information………………………………………………………….. 35
4 Revision History
Changes from Revision B (May 2019) to Revision C (July 2021)
Page
• Removed GND pin absolute maximum rating………………………………………………………………………………………. 5
• Added DRDY/INT pin absolute maximum rating…………………………………………………………………………………… 5
• Added information from multiple table footnotes to Recommended Operating Conditions table………………….. 5
• Changed temperature accuracy maximum for 5℃ < TA < 60℃.........................................................................6
• Added TEMPPSRR parameter..............................................................................................................................6
• Changed reference material for Storage and Handling ..................................................................................... 9
• Added content to the Heater section................................................................................................................ 10
• Added 0.5 to make Equation 1 –40.5 match more closely to the silicon and added PSSR equation...............18
• Added 0.5 to make Equation 4 –40.5 match more closely to the silicon and added PSSR equation...............21
• Added 0.5 to make Equation 7 –40.5 match more closely to the silicon and added PSSR equation ..............25
• Added 0.5 to make Equation 9 –40.5 match more closely to the silicon and added PSSR equation...............25
• Changed reference material in the Storage and Handling section................................................................... 32
• Added Typical Relative Humidity Accuracy Range Limits graphic....................................................................32
Changes from Revision A (October 2018) to Revision B (May 2019)
Page
• Added the pin type for DRDY/INT pin ................................................................................................................4
• Changed description of behavior of TH_STATUS bit when INT_MODE is set to 1.......................................... 12
• Changed description of behavior of TH_STATUS bit when INT_MODE is set to 0 ......................................... 12
• Changed description of behavior of TL_STATUS bit when INT_MODE is set to 1...........................................13
• Changed description of behavior of TL_STATUS bit when INT_MODE is set to 0 ..........................................13
• Changed description of behavior of HH_STATUS bit when INT_MODE is set to 1..........................................14
• Changed description of behavior of HH_STATUS bit when INT_MODE is set to 0..........................................14
• Changed description of behavior of HL_STATUS bit when INT_MODE is set to 1.......................................... 15
• Changed description of behavior of HL_STATUS bit when INT_MODE is set to 0 ......................................... 15
• Changed the units for Humidity threshold low from: °C to: %RH......................................................................26
• Changed the temperature resolution decoding from: 8 bit to: 9 bit ..................................................................28
• Changed the humidity resolution decoding from: 8 bit to: 9 bit ........................................................................28
• Changed the measurement configuration "10" bit encoding from: Humidity Only to: NA for field
MEAS_CONF[1:0] ........................................................................................................................................... 28
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HDC2080
SNAS678C – MAY 2018 – REVISED JULY 2021
Page
Changes from Revision * (May 2018) to Revision A (October 2018)
• Changed header cell in the Read Single Byte table from: Slave address (R) to: Slave address (W)...............16
• Changed header cell in the Read Multi Byte table from: Slave address (R) to: Slave address (W)................. 16
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HDC2080
SNAS678C – MAY 2018 – REVISED JULY 2021
5 Description (continued)
www.ti.com
Programable temperature and humidity thresholds in the HDC2080 allow the device to send a hardware
interrupt to wake up the microcontroller when necessary. In addition, the power consumption of the HDC2080 is
significantly reduced, which helps to minimize self-heating and improve measurement accuracy.
The HDC2080 is factory-calibrated to 0.2°C temperature accuracy and 2% relative humidity accuracy.
6 Pin Configuration and Functions
PIN
NO.
NAME
SDA
GND
ADDR
DRDY/INT
VDD
SCL
1
2
3
4
5
6
I/O
I/O
G
I
O
P
I
Figure 6-1. DMB Package 6-Pin PWSON Top View
Table 6-1. Pin Functions
DESCRIPTION
Serial data line for I2C, open-drain; requires a pullup resistor to VDD
Ground
Address select pin – leave unconnected or hardwired to VDD or GND.
Unconnected slave address: 1000000
GND: slave address: 1000000
VDD: slave address: 1000001
Data ready/Interrupt. Push-pull output
Positive Supply Voltage
Serial clock line for I2C, open-drain; requires a pullup resistor to VDD
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Top View1SDA2GNDADDR3DRDY/INT4VDD5SCL6RHSENSOR www.ti.com
VDD
ADDR
SCL
SDA
Tstg
(1)
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
Applied Voltage on VDD pin
Applied Voltage on ADDR pin
Applied Voltage on SCL pin
Applied Voltage on SDA pin
DRDY/INT
Applied Voltage on DRDY/INT PIN
Storage temperature
HDC2080
SNAS678C – MAY 2018 – REVISED JULY 2021
MIN
–0.3
–0.3
–0.3
–0.3
-0.3
–65
MAX
UNIT
3.9
3.9
3.9
3.9
V
V
V
V
V
VDD + 0.3
150
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
7.2 ESD Ratings
V(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged device model (CDM), per JEDEC specification JESD22-C101(2)
(1)
(2)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
VDD
TTEMP
TRH
THEATER
RHOR
PARAMETER
Supply voltage
Temperature Sensor - Operating free-air temperature
Relative Humidity Sensor - Operating free-air temperature(1)
Integrated Heater - Operating free-air temperature
Relative Humidity Sensor (Non-condensing)(1)
(1)
Prolonged operation outside the recommended temperature operating conditions and/or at >80%RH with temperature in the higher
recommended operating range can result in a shift of sensor reading, with slow recovery time. See High Temperature and Humidity
Exposure for more details.
7.4 Thermal Information
THERMAL METRIC(1)
RθJA
RθJC(top)
RθJB
ΨJT
ΨJB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
RθJC(bot)
Junction-to-case (bottom) thermal resistance
HDC2080
WSON (DMB)
6 PINS
56.4
73.6
24.0
3.8
24.0
13.0
UNIT
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
VALUE
UNIT
±2000
±500
V
MIN
1.62
–40
–20
–40
0
MAX UNIT
3.6
125
70
85
V
°C
°C
°C
100 %RH
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